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SIP4 Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl236.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land.

• 20-lead surface-mounted (SMD) DIP package, row spacing 11.48.
• 1.35458 vertex 9.38269 -1.41421 6.17306 vertex 4.50882.

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