Labels Milestones
BackLTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes count 16.
- 7.070963e-001 3.148567e-003 7.071103e-001 facet.
- 1x35 2.00mm single row Surface mounted socket.
- MNR02 (see mnr_g.pdf Chip Resistor Network.