Labels Milestones
BackLayout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array.
- Mounting-hole-offset 33.3mm 26-pin D-Sub connector horizontal angled 90deg.
- Phoenix MKDS-1,5-3-5.08 pitch 5.08mm size 40.6x9.8mm^2.
- Http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for Kodenshi SG-105.