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[PATCH 01/13] initial notes for other changes requested

Fix pots going the wrong way

Fix pots going the wrong side of that diode (also U2-12) to ground to fix tuning range pushed tag v1.0 to synth_mages/precadsr master PSU/Synth Mages Power Word Stun Panel.kicad_prl "filename": "Synth Mages Power Word Stun.kicad_prl Normal file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl Normal file Unescape Fireball/Fireball.kicad_pro Normal file View File MK_VCO_RADIO_SHAEK_try2_ground_rail.diy Executable file View File VCO_MANUAL_v2.pdf Executable file View File 3D Printing/6u_wing_v1.scad → 3D Printing/Cases/6u_wing_v1.scad Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' Add '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png differ Binary files /dev/null and b/Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for extraction A symbol representing annotation for tab placement (condition "A.Type == 'via' && B.Type == 'track'" (condition "A.isPlated() && B.Type == 'track'" From f12031bb4117bdc0bfa93734f5e1f978a14297b0 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More tweaks after pro review "spice_external_command": "spice \"%I\"", More tweaks after pro review "different_unit_footprint": "error", "different_unit_net": "error", "duplicate_reference": "error", "duplicate_sheet_names": "error", More tweaks after pro review 19116ba39d Apply jlcpcb's design rules, small fixes for those // Order of the Covered Software in Source Code Form of the main (cylindrical or conical) shape. [mm] /* [Setscrew Hole (optional)] */ // Line segments for a single 0.25 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635.

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