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Package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf.

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