3
1
Back

(LZ) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 52 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST SH top entry JST JWPF side entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-164.

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