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BackFn4, hg y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 module knurled_finish(ord, ird, lf, sh, fn, rn [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf1), ird*sin(lf1), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf0), ord*sin(lf0), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes unplated through.
- Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with.
- Pitch=38.86mm, , diameter=50.8mm, Vishay, IHB-6, http://www.vishay.com/docs/34015/ihb.pdf.
- HDMI, Micro, Type D, THT/SMD hybrid, 0.4mm pitch.
- Loop as test point, loop diameter2.6mm, hole diameter.