synth_tools

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64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0910, with PCB locator, 11 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0810, with PCB cutout, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm.

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