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6x6 raster, 2.605x2.703mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 28-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-Lead Plastic Dual Flat, No.

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