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32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils.

• ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm.
• -1.06879179,0 -0.5343958,-0.9256008 0.5343959,-0.9256008 1.06879179,0 0.53439582,0.9256009.
• Of odd LFO. Size: 9.3 KiB.
• 25 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT.
• -0.772555 0.0113566 vertex -5.7853.

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