Labels Milestones
BackForce socket, through-hole, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils.
- (https://katalog.we-online.com/em/datasheet/9775056960.pdf), generated with kicad-footprint-generator.
- -9.055663e+01 1.011513e+02 1.104489e+01 facet.