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See http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Vertical RM 2.54mm staggered type-2 TO-220-15, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-5 Vertical RM 2.54mm TO-220-4, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm staggered type-2 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-5, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 3.81mm TO-264-5, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-11, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-5, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7.

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