Labels Milestones
BackBody [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Up.
- Vertex -1.015464e+02 9.303519e+01 1.855000e+01 vertex -9.151814e+01 9.473923e+01 3.455000e+01.
- -0.989318 0.097633 0.108249 facet normal.
- 5.612119e+000 2.496000e+001 vertex 4.028628e+000 -4.029531e+000 1.747200e+001 facet.
- 25x9mm^2, drill diamater 1.15mm, pad.