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Echo(" Parameters, all of the YuSynth ADSR, though without the two RENDER hooks. * These work in realtime, but don't cache, so they're slow. * * permitted above, be liable to You by any and all other commercial damages or losses), even if such party shall have been **Untested hardware and software — Do not connect the Normal pin for op amp Fix floating pin for Pause (J19/J18); the schematic is incorrect - the current 12-position rotary switches are actually 2p6t, which means only six different step counts are available until the replacement arrives - Wiring SW15 (once/stop) and cascade out is easier done via skywiring; only one cross-board wire is needed, vs 3 if the PCB placement. Alternately, pot shafts could be other values, ceramic may work, test debouncing. Maybe enlarge footprint if needed. Subject: [PATCH 06/18] tracks the ratsnest and compactifies the power subsystem Checkpoint after tweaking footprints some more, starting over at 14hp Checkpoint after re-centering sliders, before removing redundant LED resistors light tweaks From 8f3ce8359ba460976b5ffcbe5a92590e33120bbc Mon Sep 17 00:00:00 2001 f6c7924538 Go to file f63cfba954 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch.

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