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High-volatge DIP package (based on standard DIP-4), row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted.

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