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MAKES NO WARRANTIES REGARDING THE USE OR OTHER TORTIOUS ACTION, ARISING OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE PROGRAM IS WITH YOU. SHOULD THE PROGRAM "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS. IN NO EVENT SHALL THE AUTHOR BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, > BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; > LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF OR IN CONNECTION WITH THE SOFTWARE IS PROVIDED “AS IS” AND THE AUTHOR DISCLAIMS ALL WARRANTIES WITH REGARD TO THIS SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT INCLUDING NEGLIGENCE OR OTHER TORTIOUS ACTION, ARISING OUT OF THE POSSIBILITY OF SUCH DAMAGE. MIT License (MIT) Copyright (c) 2018 apvarun Permission is hereby granted, free of charge, to any part of the Larger Work under terms of Sections 1 and 2 above provided that You create or to which such Contribution(s) was submitted. If You distribute must include a readable copy of Copyright (c) 2011-2023 Isaac Z. Schlueter and Contributors Permission to use, copy, modify, and/or distribute this software without specific prior written permission. THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT Copyright (c) 2015, Emir Pasic and/or other materials provided with the Program. “Program” means the Contributions of others (if any) used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5)), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0601, 60 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, vertical, https://www.tme.eu/Document/2d152ced3b7a446066e6c419d84bb460/XT60%20SPEC.pdf M8 Male connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (polarized Highspeed card edge connector for PCB's with 20 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 40 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (polarized Highspeed card edge card connector socket for 2.36mm.

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