Labels Milestones
BackPitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x24.42mm 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.
- CPAL-1.0 OR AGPL-1.0 Copyright (c) 2020-2024 Meili.
- Electronics 9774040482 (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated.