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11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row.

• Rating, https://datasheet.lcsc.com/lcsc/2211161000_HCTL-HC-TYPE-C-16P-01A_C2894897.pdf USB 3.0 3.1 3.2 4.0 Type-C.
• Pin (https://www.nxp.com/docs/en/package-information/98ASA00734D.pdf), generated with kicad-footprint-generator.
• 1.10469 19.8418 vertex 3.22377 2.17372 19.9 facet.

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