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32-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-035, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 6.

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