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Tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, SLF7045, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xx-DV-TE, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_automotive_power_slf10145-h_en.pdf Inductor, TDK, SLF6025, 6.0mmx6.0mm (Script generated with kicad-footprint-generator XP_POWER ITXxxxxSA SIP DCDC-Converter XP_POWER IHxxxxSH, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf), generated with kicad-footprint-generator JST J2100 series connector, BM14B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1105, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.megastar.com/products/fusetronic/polyswitch/PDF/smd2920.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-24A2, example for new part number: 22-27-2031, 3 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 8-Lead Plastic Small Outline (SS)-5.30 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm.

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