Labels Milestones
BackSimulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937.
- TXC 9HT11 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package.
- -4.33969 5.83811 7.81812 facet normal 3.839834e-02.