Labels Milestones
Back[SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 6.73.
- 0.237833 0.890409 vertex 3.30888.
- -0.024393 0.106447 0.994019 vertex 5.24702 5.16396 6.86308 facet.
- B15B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST.