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BackPitch DDB Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, vertical, SMT J bend https://dznh3ojzb2azq.cloudfront.net/products/Slide/JS/documents/datasheet.pdf MEC 5G single pole double throw, separate symbols | | | | | J7 | 1 | SW_Push | Push button switch, push-to-open, generic, two pins K switch single-pole double-throw spdt ON-ON K reed magnetic switch D reed switch, default-closed D SPDT reed switch K switch dual double-pole single-throw OFF-ON D Double Pole Single Throw (SPST) switch D MEC 5G single pole double throw, separate symbols Quad Low-Noise JFET-Input Operational Amplifiers, DIP-8/SOIC-8/TO-99-8"/>
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