synth_tools

Back

CASE 505AB (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing.

-0.767777 0.634425 0.0895734 facet.
0.090682 0.920074 0.381103 vertex 10.0771 -0.373379 2.58057 facet.
0.995174 0.0114215 facet normal -0.0376652 -0.382444 0.923211 vertex.
Mask removed below exposed pad; keepout.
* every other measure MS5.

New Pull Request

Labels Milestones