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Http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 1x03, 1.27mm pitch, double rows Through hole angled socket strip, 2x34, 1.27mm pitch, single row Through hole straight pin header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header THT 1x13 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x02 2.00mm single row Through hole pin header SMD 2x20 1.00mm double row Through hole pin header SMD 1x11 1.27mm single row style2 pin1 right Through hole socket strip THT 2x06 2.54mm double row Through hole pin header THT 2x20 2.00mm double row surface-mounted straight pin header, 2x18, 1.00mm pitch, double cols (from Kicad 4.0.7.

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