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Hole 2mm, no annular m5 iso14580 Mounting Hole 6.4mm, M6 mounting hole 5.5mm no annular mounting hole 6.4mm no annular m5 iso14580 Mounting Hole 6.4mm, no annular, M6 mounting hole 2.7mm m2.5 Mounting Hole 8.4mm, M8 mounting hole 3mm no annular Mounting Hole 5.5mm, no annular m5 Mounting Hole 2.2mm, M2 mounting hole 6.4mm m6 iso14580 Mounting Hole 2.2mm, no annular, M6, ISO14580 mounting hole 2.2mm no annular m4 din965 Mounting Hole 6.4mm, no annular, M6, ISO7380 mounting hole 5.3mm m5 Mounting Hole 8.4mm, M8 mounting hole 3.5mm no annular m4 Mounting Hole 2.7mm, M2.5 mounting hole 2.1mm no annular m8 Mounting Hardware, inside through hole 2.7mm, height 2, Wuerth electronics 9774020360 (https://katalog.we-online.de/em/datasheet/9774020360.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0015 example for new part number: 26-60-4030, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 8.61mm 338mil SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole.

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