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See http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 1.7mm staggered type-2 TO-220-7 Vertical RM 1.7mm staggered type-1 TO-220F-7 Vertical RM 1.27mm staggered type-2 TO-220F-15 Vertical RM 4.58mm IPAK TO-251-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil.

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