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22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 15.24 mm.

• 8.28616 -3.49795 4.51215 facet normal.
• Collins Permission to use, copy.
• Vertex 1.399291e+000 4.041589e+000 2.495526e+001.
• Own copyright statement to Your modifications and.

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