Labels Milestones
BackAntenna Class 2 Bluetooth Module with on-board components Added hard sync to schematic, laid out PCB with 2 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x16 1.27mm single row Through hole pin header THT 1x23 1.27mm single row style2 pin1 right Through hole straight socket strip, 1x32, 2.54mm pitch, double rows Through hole IDC header, 2x08, 2.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x32, 1.00mm pitch, single row Through hole pin header THT 2x21 2.54mm double row Through hole angled pin header, 2x13, 2.00mm pitch, single row Through hole angled pin header, 1x37, 1.27mm pitch, single row Through hole straight socket strip, 1x28, 2.54mm pitch, single row style2 pin1 right Through hole socket strip SMD 1x33 1.27mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x18 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x32 1.27mm double row Through hole angled pin header SMD 1x16 2.00mm single row (from Kicad 4.0.7), script generated Through hole vertical IDC box header, 2x04, 1.00mm pitch, single row Through hole straight socket strip, 1x28, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x21 1.27mm double row surface-mounted straight pin header, 2x01, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header, 2x11, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 1x40, 2.54mm pitch, 6mm pin length.
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- Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf.
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