3
1
Back

Hole, DF63R-3P-3.96DSA, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator JST XH series connector, 202396-0707 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 46 Pin (http://www.ti.com/lit/ds/symlink/lp5036.pdf#page=59), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0804, 80 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0411-3-51, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2104, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP-UQ, 10 Pin (https://www.ti.com/lit/ml/mpqf186d/mpqf186d.pdf Texas RSE0010 UQFN NoLead Texas VQFN-HR, 11 Pin, https://www.ti.com/lit/ml/mpqf579/mpqf579.pdf Texas WQFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, through hole 2.7mm, height 2, Wuerth electronics 9774020360 (https://katalog.we-online.de/em/datasheet/9774020360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xx-DV-PE-LC, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, DF3EA-10P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10.

New Pull Request