Labels Milestones
BackZED GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board antenna Class 2 Bluetooth Module with on-board components Added hard sync to schematic, laid out PCB with exploratory 8hp layout Add schematic, start on PCB Checkpoint after tweaking footprints some more, starting over at 14hp main synth_tools/3D Printing/Cases/Eurorack Modular Skeleton/Eurorack_box_v105.stl Executable file Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-F_Cu.gbr Normal file Unescape Hardware/PCB/precadsr/precadsr.sch Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/analogoutput.kicad_mod Normal file Unescape f33ea6a168 Go to file traces added but maybe won't keep traces_before_hard_sync Fix for component clearance, panel thickness from printer realities Fix rail clearance issues, add PCB slot, more options for potentiometer spoke placement' (#1) from bugfix/10hp into main Merge pull request synth_mages/MK_VCO#5 b554ec2138 Add footprint items for panel holes; separate panel and pcb into different files Add footprint items for panel holes; separate panel and pcb into different files Add a horizontal wall (across the panel design and.
- RM 4.58mm IPAK TO-251-3, Horizontal, RM 5.45mm.
- 0.65 thermal pad HTSSOP32.
- Wuerth Elektronik, Wuerth_HCM-7070, 7.4mmx7.2mm Inductor.