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350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x21.88mm 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 6.7x11.72mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf Linear UKG52(46) package, QFN-52-1EP variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter.

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