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6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads.

• Type067_RT01902HDWC, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LL-504BC2E-009.pdf LED diameter 3.0mm.
• TSOP; Type II TSOP-II, 44.
• CR-2354/VCN coin cell retainer CR2032 BR2032.
• 0.48503 -0.124395 0.865605 facet normal 2.890023e-001.

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