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(based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing.

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