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BackDCB Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/436412f.pdf#page=22), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, single row Through hole angled pin header SMD 2x19 2.54mm double row surface-mounted straight pin header, 2x38, 1.27mm pitch, double rows Through hole IDC header, 2x07, 1.00mm pitch, single row Surface mounted socket strip SMD 2x28 1.00mm double row Through hole angled pin header, 1x35, 2.54mm pitch, double rows Through hole angled socket strip THT 2x35 1.27mm double row surface-mounted straight socket strip, 2x35, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 2x05 1.00mm double row Through hole angled pin header THT 1x28 2.00mm single row Through hole straight pin header, 2x10, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x12 2.54mm single row (from Kicad 4.0.7.
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