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QFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package.

9.695134e+01 1.291278e+01 facet normal -0.703598 -0.707106 -0.0703595 vertex.
To improve on this one, but many external.
DF63R-2P-3.96DSA, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf.
5.19298 -5.19298 6.86102 vertex 5.17982 -5.20899.

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