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Humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module Digital Proximity, Ambient Light, RGB and Gesture Sensor (https://docs.broadcom.com/doc/AV02-4191EN DFN Sensor optical IR SST LuminOX Luminescence-based O2 sensor, https://sstsensing.com/wp-content/uploads/2021/08/DS0030rev15_LuminOx.pdf Gas Sensor, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF DFN 0.65P dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0415-4-51, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0008 example for new part number: 26-60-4050, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 8 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py USON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xx-DV-TE, 26 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Broadcom LGA, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf), generated with kicad-footprint-generator JST XA series connector, LY20-18P-DLT1, 9 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf.

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