Labels Milestones
BackSocket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD SMD 6x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed.
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