Labels Milestones
BackSocket 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x16.8mm 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [TQFP.
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