Labels Milestones
BackWLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm.
- 6.160168e+00 vertex -1.092367e+02 9.695134e+01.
- 500 VAC 4W/16A (VDE), 600V 30A (UL/CSA.
- Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body.