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Pins, http://ww1.microchip.com/downloads/en/DeviceDoc/51751a.pdf module CMS SOT223 8 pins, pitch 3.5mm, size 18.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, hole diameter 1.5mm THT rectangular pad as test point, loop diameter2.6mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test point, loop diameter2.6mm, hole diameter 1.1mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole straight socket strip, 2x36, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 1x04 2.00mm single row Through hole angled pin header SMD 2x40 1.27mm double row Through hole angled pin header, 2x07, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x35 2.00mm double row Through hole angled socket strip SMD 1x05 2.00mm single row Through hole straight pin header, 1x38, 1.00mm pitch, single row male, vertical entry, with latches, PN:G125-MVX2605L1X Harwin Gecko Connector, 12 pins, pitch 2.54mm, hole diameter 1.3mm, wire diameter 0.5mm test point plated hole Plated Hole as test Point, square 2.5mm side length, hole diameter 0.7mm THT rectangular pad as test Point, square 4.0mm side length, hole diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0530, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xxx-DV, 31 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-08A1, example for new mpn: 39-29-4089, 4 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py ST HLGA, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator JST PH series connector, 505405-0770 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213.

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