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See http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-4, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220-11, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-15 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 5.45mm TO-264-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-9 Vertical RM 5.08mm TO-220-3, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7 Horizontal RM 2.29mm IPAK TO-251-3, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 1.7mm staggered type-1 TO-220-9 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-7, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-11, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP.

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