3
1
Back

Body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 28 pins TSOP-I, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 11.6, Wuerth electronics 9771140360 (https://katalog.we-online.com/em/datasheet/9771140360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Lead Frame Chip Scale Package - 10x10x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf HSOP.

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