Labels Milestones
BackSOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline.
- Diode SMF (DO-219AB), http://www.vishay.com/docs/95572/smf_do-219ab.pdf D_SOD-128.
- 0.161832 -0.533413 0.83023 facet normal.