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LowProfile 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (ST)-4.4 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads in-line, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-5, Horizontal, RM 1.27mm, staggered type-2 TO-220-7 Horizontal RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-5, Horizontal.

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