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0.2, "diff_pair_gap": 0.25, "diff_pair_via_gap": 0.25, "diff_pair_width": 0.2, "line_style": 0, "microvia_diameter": 0.3, "microvia_drill": 0.1, "name": "Default", "pcb_color": "rgba(0, 0, 0, 0.000)", "track_width": 0.25, "via_diameter": 0.8, "via_drill": 0.4, More tweaks after pro review "spice_external_command": "spice \"%I\"", Inkscape export via OpenSCAD DXF Export Fix R25/R1 connection One socket connection is on the larger board underneath the smaller board. #Kicad 7 # 2-layer, 1oz copper condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == A.Type && A.Net != B.Net" condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == A.Type && A.Net != B.Net" condition "A.Type == 'via' && B.Type == A.Type" (condition "A.Type == 'via'" condition "A.Type == 'via' && B.Type == 'track'" condition "A.Type == 'pad' && B.Type == A.Type")) # 4-layer condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" condition "A.Net != B.Net" (condition "A.Type == 'via'" condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" condition "A.Net != B.Net" condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == 'graphic')" (condition "A.Type == 'via'" condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" (condition "A.Net != B.Net" condition "A.Type == 'track'" (condition "A.Type == 'track' && B.Layer == 'Edge.Cuts'")) # drill/hole size condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == A.Type" condition "A.Type == 'track' && B.Type == 'graphic')" # This would override board outline and milled areas # (condition "A.Type == 'via'" condition "A.Type == 'via' && B.Type == 'track'" .

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