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SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO.

• LN1, LN2, LN3 and then.
• 0.302887 0.246448 facet normal -0.598005 0.573948.

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