Labels Milestones
BackSolder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x37 1.00mm single row Through hole IDC header, 2x05, 2.00mm pitch, double rows Through hole socket strip SMD 1x17 1.00mm single row Through hole straight socket strip, 2x26, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header THT 1x02 5.08mm single row male, vertical entry, strain relief clip Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89008xx, 8 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, S6B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc7593.pdf (page 432)), generated with kicad-footprint-generator JST GH series connector, 78171-0003 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD.