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SSOP56: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD.

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