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SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead.

• HLE-105-02-xxx-DV, 5 Pins per.
• 506CE (see ON Semiconductor.
• 2x06, 2.54mm pitch, 8.51mm socket length.

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